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Vacancy posted: Tuesday, 24 Aug 2010

National Semiconductor CMP (Speedfam) Equipment Engineer Greenock   £Competitive

Please note: This vacancy is no longer advertised.

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Company Profile:

National Semiconductor creates analog-intensive solutions that differentiate customers' products by providing lower power consumption, higher speed, greater precision, increased portability, better audio and sharper images in electronics systems. National’s leading-edge, energy-efficient analog products enhance personal mobile devices (cell phones, smart phones and MP3 players), LED lighting and electronics such as medical, automotive, and test and measurement equipment. Its Solar Magic technology, launched in 2008, is built upon National’s analog and power management circuits and provides enhanced energy output of solar arrays. Headquartered in Santa Clara, Calif., National reported sales of $1.46 billion for its most recent fiscal year.

We are currently recruiting for a number of permanent positions within our UK Manufacturing and Design centre. We advertise all of our vacancies via our company website http://www.national.com/analog/careers

 

CMP (Speedfam) Equipment Engineer – Staff level


Working as part of the Interconnect Equipment Engineering Group and reporting directly to the Engineering Section Manager, you will be responsible for the following:

·Ensures Risk Assessments, Safe Working Practices and Safety Isolation procedures for equipment set is kept up to date and are in use.
·Design / optimisation of PM schedules to improve reliability.
·Cost of ownership reduction.
·Ensure tool hit modelled availability targets. Also, continually improving this metric.
·Ensures that stock inventories (min/max) are optimised to support wafer starts and cost control
·Mentors shift technicians to close out technical issues and ensure tool infrastructure of procedures, parts and OCAPS are in place.
·Working with equipment vendors to maximise equipment efficiency.
·Devise training and development strategies for tool set continuous improvement.
·Work with Process Engineering to reduce sPC violations through the design of output parameter OCAP’s and migration of ownership of charts from Process to Maintenance group where applicable.
·Develop input parameter capability and ensure this is embedded with clear training and OCAP’s.

Qualifications
Degree/HND/HNC in an appropriate discipline is required, plus proven skills in equipment maintenance or process engineering within the semiconductor industry.

CMP Equipment Engineer. Extensive Speedfam CMP experience essential.
Should have high level knowledge of TPM principles and should be able to demonstrate proven skills in Planned Maintenance and reliability engineering programmes.

Closing Date:     01-Oct-2010