Manufacturing Engineer

Manufacturing Engineer – Semiconductor Assembly (Microelectronics & Optoelectronics) – Night shift

Company Background

ALTER TECHNOLOGY TÜV NORD UK Limited (ALTER UK) provides contract package design and assembly services for a wide range of semiconductor devices. ALTER UK is a subsidiary of ALTER TECHNOLOGY TÜV NORD SAU and is part of world leading technical services provider TÜV NORD’s Digital & Semiconductor Business Unit.

Job Brief

We are looking for a highly skilled Process Engineer to oversee and optimize the assembly of our next-generation microelectronic and optoelectronic products. You will own the manufacturing processes from initial die attach and wire bonding to complex optical alignment and encapsulation. Your primary focus will be maximizing yield, ensuring stringent quality standards, and driving continuous improvement in a cleanroom environment.

Responsibilities

• Production support: First point of contact for production staff for technical and process issues on shift
• Process Ownership: Optimize core assembly processes, including die attach, wire bonding, flip-chip, encapsulation, and precision optical alignment.
• Yield Improvement: Analyse manufacturing data to identify bottlenecks, eliminate defects, and implement corrective actions.
• Equipment Integration: Program, calibrate, and troubleshoot automated assembly and optical testing equipment.
• Quality Control: Apply Statistical Process Control (SPC/Cpk) and Design of Experiments (DOE) to maintain stable production.
• Documentation: Create and update Standard Operating Procedures (SOPs), failure analysis reports, and manufacturing instructions.
• Cross-Functional Collaboration: Partner with R&D and Engineering Leads to transition new products from prototype to high-volume manufacturing.

Requirements

• Education: Degree in Engineering (Mechanical, Electrical, Materials Science, or Physics) - (lower qualifications will be considered if the applicant has more than 2 years relevant industrial experience).
• Technical Skills: Hands-on experience with sub-micron placement tools, wire bonders, and optical sub-assembly (OSA) processes.
• Methodologies: Strong proficiency in Six Sigma, root cause analysis (8D), and SPC software.
• Working Environment: Comfortable working extensively inside a cleanroom (Class 100/ISO 5 or similar).
• Knowledge: Knowledge in Semiconductor packaging equipment advantageous:
• Wafer Saw
• Die Attach (epoxy and / or solder)
• Wire Bond (Au ball and / or Al wedge)
• Mold injection (plastic packaging)
• Parallel Seam Sealing / Projection Welding
• Plasma Cleaning

Benefits

• Life Assurance
• Private Medical Insurance
• Matched Pension Scheme: Up to 6% matched contributions
• Tech Scheme/Cycle to Work Scheme
• Electric Vehicle Scheme
• Recruitment Reward Scheme
• Competitive Salary: With annual reviews
• 33 Days Holiday Per Year: Increases with service up to 36 days
• Company Sick Pay
• Enhanced Maternity/Paternity Leave
• Flexible Working Options & Flexi Time
• Monthly Pizza Day – On Us!
• Free Tea & Coffee

Location

The role is based at our facility in Livingston, UK.

The role will be a permanent night shift position after initial training period.